[Cite as http://purl.org/au-research/grants/arc/LP140100344]
Researchers Prof Michael Heimlich; Prof Candace Lang; Prof Anthony Parker; Dr James Downes; Dr Simon Mahon; Mr Renato Morosin
Brief description This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project will deliver a miniaturized packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. In this way, the project will enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.
Funding Amount 450000
Funding Scheme Linkage Projects